High Speed Sorting Machine S10
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- Details
| Applications: | |
| 1 | High speed and High accuracy die sorting |
| 2 | Apply for varied chips sorting flipping and transfer |
| Basic functions | |
| 1 | Placement accuracy: XY:≤±38μm@3σ Θ resolution:≤±2° |
| 2 | Vision system： 1μm/pix to 10μm/pix (customer design support) |
| Technical specification | |
| 1 |
Wafer XY table： Maximum Travel： 8″*8″（230mm*350mm） Flipping Angle：90° Wafer Input： ø6″ or ø8″（Optional） can also support 2”and 4” Gel-pack/Waffle-pack Z axis travel of needle： 3mm |
| 2 |
Die bonding XY Table： Maximum Travel： X Y（230mm*350mm） Accuracy： ±0.3mil Repeatability： ±0.2mil |
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