Die Bonder X10
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- Details
| Applications: | |
| 1 | Apply for epoxy die attach |
| 2 | Suitable for LED / LED Array die attach |
| Basic functions | |
| 1 | Apply for SMD, PCB, Matrix, Shaped Array, high power and other kinds of LED chips. |
| 2 | Dual-vision system: Adjustable vision recognition system |
| Technical specification | |
| 1 |
Wafer XY table： Maximum Travel： 8″*8″（203mm*203mm） Accuracy： ±15um，3σ Wafer Input： ø6″ or ø8″（Optional） Z axis travel of needle： 3mm |
| 2 |
Die bonding XY Table： Maximum Travel： 4″*8″（101mm*203mm） Accuracy： ±0.3mil Repeatability： ±0.2mil |
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