Die Bonder X20_Equipment_Products

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Applications:
1	Apply for epoxy die attach
2	Suitable for COB/BOX, IC and chip die attach
Basic functions
1	Support minimum 0.15x0.15mm die size , optimize for semiconductor and optical communication industry application .
2	Three Downward-looking camera and one high-power upward-looking camera with 4 kinds of programmable lighting (Collimated white light and RGB ring light).
Technical specification
1	Wafer X/Y Table： Maximum Travel：360mmx280mmx20mm Accuracy： ±7um@3σ Wafer Input： Dual ø6″ wafer stage PP tool：auto change PP tools, can support 13pcs tools on the rack, pick-up force control range from 10g to 1500g (Real-time closed loop feedback) Epoxy Dispensing： programmed dispensing
2	Auxiliary table： Bonding area: one mid-stage , ten 2” waffle-pack or gel-pack Automatic transportation Vision system: three downward-looking camera and one high-power upward-looking camera Lighting system: Camera with 4 kinds of programmable lighting(Collimated white light and RGB ring light)