Die Bonder X30
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- Details
| Applications: | |
| 1 | Support multi-die bonding application, automatic PP tools change. |
| 2 |
Support substrate size from 50~175mm*60~98mm*0.7~1.6mm Support chip size : 0.15*0.15mm~8*8mm |
| Basic functions | |
| 1 |
Automatic positioning by up-looking and or down-looking vision system； Automatic upload/download system Automatic pick and place test function by glass film (BMC） |
| 2 |
High stable force control system with voice coil torque ring and encoder . Programmable force range : 20~800g High flexible dual dispensing system, support customized dispensing pattern, friendly GUI and support EPOXY IQC and POST IQC graphical display |
| Technical specification | |
| 1 |
Bonding XYZ table： Accuracy : ±3μm @3σ； Θ resolution: ±0.3°@3σ； Wafer system：support 3pcs ø6″ wafer UPH：800 (depend on wafer chip density) bond force：20~800g |
| 2 |
Auxiliary table： Magazine system：100~320mm*35~130mm*68~190mm PR system：256 grayscale Resolution：2448pixel*2048pixel Support gray value template, custom shape template, standard shape template ; customized searching ROI , Subpixel alignment accuracy |
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